Copper sulfate plating additive for PCBs

Lucent Copper AZ

	Excellent throwing power at high current density area.
	Excellent throwing power on high aspect through hole.
	Provide excellent ductility, malleability deposit and thermal shock resistance.
	Provide low internal stress deposit.
	Additive concentration can be analyzed by CVS.
	Acid copper plating additive (For soluble anode).

　● Acid copper plating bath is strong acidity and corrosive liquid.

　● Exhaust ventilation is recommended to remove mist or vapors during operation.

	Excellent throwing power at high current density area.
	Excellent throwing power on high aspect through hole.
	Provide excellent ductility, malleability deposit and thermal shock resistance.
	Provide low internal stress deposit.
	Additive concentration can be analyzed by CVS.
	Acid copper plating additive (For Insoluble anode).

　● Acid copper plating bath is strong acidity and corrosive liquid.

　● Exhaust ventilation is recommended to remove mist or vapors during operation.

	Excellent via filling and throwing power performance at high current density area, low-build deposit.
	Provide excellent ductility and malleability deposit and thermal shock resistance.
	Suitable for via filling and through-hole plating of PWBs.
	Additive concentration can be analyzed by CVS machine.

High via filling performance and compatible with Any-layer (Multi-layer) Boards.

< Any Layer Boards(Multi-layer) >

Compatible with mix of through hole and via hole.

< Mixed through hole and via hole board. >

　● The working solution is strong acid and corrosive.

　● Exhaust ventilation is recommended to remove mist or vapors during operation.

	Excellent via filling performance with a flat via top.
	Excellent uniform electrodeposition, with less reduction in plating thickness at through hole corner.
	Excellent in-plane uniformity.
	Provide excellent ductility deposit and thermal shock resistance.
	Additive concentration can be analyzed by CVS.