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Kanigen (Thailand) Co., Ltd.
Pioneer of Electroless Nickel (Kanigen) Plating since 1955

Plating Device


Plating device that offer excellent operability, workability, and safety and can consistently use our plating solutions

The SACP III(autoanalyzer and replenishment machine) ability to always maintain the optimal plating solution by automatically replenishment and managing the nickel concentration, pH value and temperature.
We are also handling the SFVP series filter pump, etc. which allows to remove impurities from the plating solution by continuously circulating the plating solution.

Auto-analyzing and replenishment device maintains the optimal condition of the plating solution

SACP-Ⅲ

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SUMER auto-analyzing and replenishment device
SACP-III

supports the optimal condition of the plating solution by analyzing and recording the nickel concentration, pH, temperature and replenish each solution automatically.

[1] Properties

  1. Maximum 5 plating solutions can be automatically measured and replenished (optional).
  2. It contributes to stabilizing the plating deposition speed and film properties.
  3. Constantly measure the nickel sulfate concentration, pH, temperature during analysis, and temperature inside the plating tank.
  4. Operation data and warning data can be printed
  5. Data is preserved even the power outage
  6. Easy-to-use touch panel operation
  7. The LED display is an easy to see

[2] Option

  • Anti-deposit power supply
  • Data management system (communication software, RS485 cable, RS485/RS232C converter, RS232C cable, PC)
  • Provide a space-saving type refilling device upon request.
  • Since this is a precision electronic device, please install it in a suitable location.​

Click here to see the specification and detailed drawings


The filter pump filters the plating solution in circulation and removes impurities

SFVP

The filter pump for Kanigen plating SFVP series

Generally, when electroless nickel plating is performed using a chemical reaction, the temperature of the plating solution is kept high (80-95°C) and the work is carried out for long periods of time.
When considering plating quality, it is important that the plating solution is always clean, but in the case of continuous production, impurities in the plating solution tend to increase as the Metal Turn Over (MTO) and plating work progresses, which is a major cause of plating defects.

Our SFVP filter pump is a filter filtration device that constantly circulates the plating solution during long plating operations at high temperatures, while removing impurities such as dirt and dust that can cause plating defects.
The vertical pump we use stainless steel in the liquid-contacting parts and use a special mechanical seal to prevent leakage, ensuring safe use without leakage during operation.
The filter housing is made of stainless steel and Heat-resistant glass, allowing you to visually check the cartridge filter for clogs and the state of the liquid at all times.

※What is Metal Turn Over?

Metal Turn Over. It is also expressed as the number of turns or MTO.
This is a number that indicates the degree of aging of the plating solution.
Based on this number, we will set a guideline for updating the plating solution.
When all the nickel sulfate contained in the plating bath in the make-up state is consumed by plating, it is one turn (1MTO).
If the make-up plating solution contains 24.0g/L of nickel sulfate.
※MTO is calculated based on the concentration of nickel sulfate at the time of make-up.
As the concentration of nickel sulfate in the plating solution varies depending on the type of plating solution, MTO is merely an indicator of the degree of aging of the solution. Please note that it is not possible to compare the performance of other plating solutions and MTO alone.

When plating progresses and 2.4g/L of nickel sulfate is consumed and 2.4g/L of nickel sulfate is replenished (2.4g/24.0g), this is expressed as 0.1MTO.

When plating progresses and 12.0g/L of Ni sulfate is consumed and 12.0g/L of Ni sulfate is replenished (12.0g/24.0g), it is expressed as 0.5MTO.

When plating progresses and 24.0g/L of Ni sulfate is consumed and 24.0g/L of Ni sulfate is replenished (24.0g/24.0g), it is expressed as 1.0MTO.

When plating progresses and 43.2g/L of Ni sulfate is consumed and 43.2g/L of Ni sulfate is replenished (43.2g/24.0g), this is expressed as 1.8MTO.

See the specification

 

Latest Update 19 Mar 2025
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