Plating Device
Plating device that offer excellent operability, workability, and safety and can consistently use our plating solutions
The SACP III(autoanalyzer and replenishment machine) ability to always maintain the optimal plating solution by automatically replenishment and managing the nickel concentration, pH value and temperature.
We are also handling the SFVP series filter pump, etc. which allows to remove impurities from the plating solution by continuously circulating the plating solution.
Auto-analyzing and replenishment device maintains the optimal condition of the plating solution |
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SUMER auto-analyzing and replenishment device
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The filter pump filters the plating solution in circulation and removes impurities |
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The filter pump for Kanigen plating SFVP seriesGenerally, when electroless nickel plating is performed using a chemical reaction, the temperature of the plating solution is kept high (80-95°C) and the work is carried out for long periods of time. Our SFVP filter pump is a filter filtration device that constantly circulates the plating solution during long plating operations at high temperatures, while removing impurities such as dirt and dust that can cause plating defects. ※What is Metal Turn Over? Metal Turn Over. It is also expressed as the number of turns or MTO. When plating progresses and 2.4g/L of nickel sulfate is consumed and 2.4g/L of nickel sulfate is replenished (2.4g/24.0g), this is expressed as 0.1MTO. When plating progresses and 12.0g/L of Ni sulfate is consumed and 12.0g/L of Ni sulfate is replenished (12.0g/24.0g), it is expressed as 0.5MTO. When plating progresses and 24.0g/L of Ni sulfate is consumed and 24.0g/L of Ni sulfate is replenished (24.0g/24.0g), it is expressed as 1.0MTO. When plating progresses and 43.2g/L of Ni sulfate is consumed and 43.2g/L of Ni sulfate is replenished (43.2g/24.0g), this is expressed as 1.8MTO. |