Neutral type electro-tin plating bath for electronic parts
Melplate SN-2680 |
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Melplate SN-2680 has less corrosive to the material's surface because of neutral type and excellent solderability for various of electronic components. |
The operating temperature range is 25 - 45 ºC, and able to utilize with a wide current density. |
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Suppress the formation of outgrowth and whisker. |
The bath is extremely stable and no generation of Sn4+ precipitation. |
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Suppress the adhesion of the workpiece and adhesion of the dummy balls. |
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Able to utilize with a Flow-Through Plater because Melplate SN-2680 is a low foaming type. |
Chip |
Tin plating is required for chip components that used in electronic circuit boards and assembled chip components onto electronic circuit boards.
Thermal shock test |
As a results of thermal shock testing, whisker was found in pure tin plating (100% of Sn). For tin-lead plating (Sn-Pb), the whisker is reduced. However, in Melplate SN-2680 no whisker generates on the surface.
Equipment |
● Tank : PVC, polypropylene, polyethylene, and rubber lining tank are recommended.
Please feel free to contact us if you have any questions or concerns about surface treatment chemicals for plating.