Copper sulfate plating additive for PCBs
Lucent Copper SVF |
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Excellent via filling and throwing power performance at high current density area, low-build deposit. |
Provide excellent ductility and malleability deposit and thermal shock resistance. |
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Suitable for via filling and through-hole plating of PWBs. |
Additive concentration can be analyzed by CVS machine. |
Cross section of via filling |
High via filling performance and compatible with Any-layer (Multi-layer) Boards.
< Any Layer Boards(Multi-layer) >
Cross section of through hole and via hole plating |
Compatible with mix of through hole and via hole.
< Mixed through hole and via hole board. >
Precautions |
● The working solution is strong acid and corrosive.
● Exhaust ventilation is recommended to remove mist or vapors during operation.
Please feel free to contact us if you have any questions or concerns about surface treatment chemicals for plating.